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PCB Design     


Ucreate has highly-skilled teams to find right solution for complex design problems, Our teams of designers are qualified engineers with over 10 years of experience, also are experts of design through PADs PowerPCB, OrCAD, and more, Ucreate have designed many types of boards range from the consumer electronics, industrial, medical, military, and telecommunications industries, the design capability runs from small samples to large & complex circuit boards.

IPC class 2 and 3, JEDEC and MIL standards are available.
• Single/double sided
• Multilayer; through via hole, blind/buried via and laser via technologies
• Flexible / flexi-rigid printed circuits
• HDI Designs with micro vias and advanced materials – Via-in-Pad, laser micro vias.
• High speed, multi layer digital PCB designs – Bus routing, differential pairs, matched lengths.
• PCB Designs for space, military, medical and commercial applications
• Extensive RF and analog design experience (printed antennas, guard rings , RF shields…)
• Signal integrity issues to meet your digital design needs (tuned traces, diff pairs…)
• PCB Layer management for signal integrity and impedance control
• DDR, DDR2, DDR3, DDR4, SAS and differential pair routing expertise
• High density SMT designs (BGA, uBGA, PCI, PCIE, CPCI…)
• Blind & Buried via ,Flex PCB designs, flexible rigid board of all types
• Low level analog PCB designs .
• Ultra low EMI designs for MRI applications
• Complete assembly drawings
• In-Circuit Test data generation (ICT)
• Drill, panel and cutout drawings design
• Professional fabrication documents creation
• Autorouting for dense PCB designs

PCB component placement and routing are carried out by experienced and committed designers to ensure an optimal layout for your high speed logic and high frequency RF boards.
Ucreate uses high frequency controlled impedance design methods, our team enables a fast autoroute service on complex designs like high density micro BGA boards.



Design Capability

Design capability

Designed value

Number of maximum design layers

40 layers

Number of maximum PINs

60000

Minimum BGA space

0.4mm

Line width/line distance

2mil/2mil(HDI)

High-speed differential pair design

2009

10Gbps,76cm

2012

14Gbps,100cm

2013

28Gbps,10.6cm


Delivery capability

Number of PINs for a single board

Delivery time of designwork day

0-1000

3-5

2000-3000

5-7

4000-5000

8-12

6000-7000

12-15

8000-9000

15-18

10000-13000

18-20

14000-15000

20-22

16000-20000

22-30

Ultimate delivery capacity

10,000pin/6days





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